Apple’s new iPhone SE goes on sale today. The curious offering seemingly mates iPhone 6s-class hardware with iPhone 5s styling but what’s actually going on under the hood? For that, we turn to Chipworks who recently performed a full teardown of the iPhone SE.
Jumping right into the internals, Chipworks found that the A9 powering the iPhone SE does indeed appear to be identical to the chip driving the iPhone 6s. The team also uncovered 2GB of LPDDR4 RAM from SK Hynix and 16GB of flash memory from Toshiba, likely made using the older 19nm manufacturing process.
Other iPhone 6s throwbacks include the 6-axis inertial sensor, a Qualcomm modem, NXP 66V10 NFC and audio ICs. The touch screen controller solution uses the same hardware that first debuted in 2011.
So, what’s new? The team found what it believes is a new Apple/Dialog power management IC, part number 338S00170 from Texas Instruments as well as a Skyworks SKY77611 power amplifier module, an AAC Technologies 0DALM1 microphone and an EPCOS D5255 antenna module.
In conclusion, Chipworks said there is still much to discover about the iPhone SE but it’s quickly becoming apparent that this isn’t your typical Apple release as there are very few new parts to speak of. That doesn’t mean the device lacks innovation, Chipworks said, as the genius of Apple and leader Tim Cook is the combination of all the right parts that make a successful product.
Chipworks said it will need to do some deprocessing to examine the silicon inside for a better understanding of the new components.
https://www.techspot.com/news/64289-iphone-se-teardown-reveals-frankenstein-mix-iphone-5s.html
