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Micron now sampling speedy 2GB Hybrid Memory Cubes

By Shawn Knight
Sep 26, 2013
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  1. Micron Technology is now shipping 2GB Hybrid Memory Cube engineering samples to select customers. Described as a dramatic step forward in memory technology, Micron’s Cube is the first to be shared broadly according to the company. But what exactly is...

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  2. OH. EM. GEE.
    This is a hardcore gamer's and 3D modeler's dream.
     
  3. JC713

    JC713 TS Evangelist Posts: 7,064   +919

    This is really exciting new tech.
     
  4. "Micron claims the solution provides an unprecedented 160GB/s of memory bandwidth and uses up to 70 percent less energy per bit compared to existing technologies – a metric that will dramatically lower a customer’s total cost of ownership."

    Dramatically lower? Really? Isn't the power usage by memory dwarved by the power the CPU (and with gaming machines the GPU) uses? So what if the memory uses 70% less energy? Does it really have a big effect on the TOTAL cost of ownership? (Not saying that it isn't nice - just asking.)
     
  5. Actually 70% is a fairly big deal. Even though memory dies don't dissipate anywhere near the wattage of a cpu die, the power dissipation limits how many dies can be stacked. Previous technology with interposers and inter-die bonds limited the stack size, but with TSV (if Micron is in fact demo'ing the long-sought after through-silicon via technology) the limit to stacking many dies becomes the wattage. Its no good stacking 15 dies if the inner 10 overheat after 4 hours of heavy throughput.

    TSV has been a hard nut to crack but it seems like we'll start seeing products on the market soon.
     


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