I mentioned thermal compound as a comparison. Where did you read that there was any thermal compound at all? Immediately above the stationary base plate is an air gap or air bearing as they say. Due to the air gap, there is no direct contact.Puiu said:Where did you read that they'll replace the thermal compound? In the diagram you can clearly read "stationary base plate" --> this will come in direct contact with the CPU (with the paste in between). They just replaced the fan+big heatsink with a more efficient way of cooling the heatsink --> they rotate the upper part of it (the biggest part).
I understand what they are saying as to how the system works but the part I don't quite see is, "heat is efficiently transferred across a narrow air gap," that's all.