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VIA Eden Platform Powers New HP Thin Clients

By Julio Franco
Jun 7, 2005
  1. Proven ultra-low power VIA Eden(TM) processor selected by HP for new range of space-saving thin clients

    Taipei, Taiwan, 7 June 2005 - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced that the high-performance, energy-efficient VIA Eden(TM) Platform will be integrated into the new HP Compaq t5125, t5520 and t5525 thin clients. Bringing enhanced levels of performance, reliability and functionality to the corporate environment, this design win further strengthens VIA's leadership in this fast-emerging market segment.

    Providing businesses with greater manageability, scalability, security and flexibility, thin clients offer a holistic cost-effective approach to corporate productivity with a network-based computing model. The new HP Compaq t5125, t5520 and t5525 fine-tune the concept with a range of smart, small footprint designs, capable of meeting the demands of the corporate environment with the high-performance, ultra-low power of VIA Eden processors.

    The new range of HP Compaq thin clients feature the highly energy-efficient VIA Eden ESP processor with ultra-low thermal profile, enabling higher performance in a small form factor and fanless design, and feature 128MB RAM and up to 256MB Compact Flash that offers enough storage memory for most current firmware and future updates and upgrades.

    The new thin clients are expected to be available mid-June 2005.
     
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