Toshiba and NEC have agreed to collaborate, working together on developing new production techniques that can reduce cost and increase efficiency, working on such projects as chip circuitry widths of 65 and 45 nanometres.
"As advances in semiconductor process technologies become more complex, time consuming and expensive, the joint development will allow the companies to share burdens and accelerate development, while raising system LSI performance and quality," they said in a joint statement.