IBM demos internal CPU water cooling

By on June 5, 2008, 6:44 PM
IBM Labs is taking water cooling to another level, literally. While cooling the surface of CPU using water has been around for a while now, researchers at IBM's Zurich lab today demonstrated three-dimensional chip stacks that are water-cooled layer by layer from the inside via pipes that are as thin as a human hair.


IBM first announced its 3D chip stacking concept in April last year. The idea is to put chips and memory devices on top of one another like a silicon sandwich, rather than arrange them side by side. This will supposedly reduce wire delay by a thousand times, improve CPU efficiency, and significantly reduce total power consumption. Until now, however, thermal dissipation has been a major obstacle for the technology as every layer in a 3D chip makes it more difficult to remove heat emanating from the lower levels.

We're still a long way off from three-dimensional processors but IBM’s prototyped water-cooling solution seems like a big step in the right direction. The company hopes to commercialize such stacks for its multi-core servers in about five to ten years.




Add New Comment

TechSpot Members
Login or sign up for free,
it takes about 30 seconds.
You may also...
Get complete access to the TechSpot community. Join thousands of technology enthusiasts that contribute and share knowledge in our forum. Get a private inbox, upload your own photo gallery and more.