Originally posted by Mictlantecuhtli
And the next question, how will this affect the temperatures? Smaller die size means smaller area that conducts heat..
- Full SSE3 implementation (?)
- Improved hardware data prefetch mechanism
- Increased number of writing combine buffers (D0 stepping A64's can now combine up to four non-cacheable streams compared to 2 o_n the C0 and CG stepping A64's)
- Improved o_n-die memory controller with more advanced open page policy
- O_n-die thermal throttling
- Black Diamond Low-K technology (slower less power hungry transistors in less used sections and faster and more power hungry transistors in frequently used sections of the cpu)
- Furthermore the new D0 A64s can convert LEA intructions into ADD instructions in certain situations wich can then be executed in a single clock cycle wich should also give a performence boost in some apps