We are having two different arguments, because you aren't understanding that the PS5 doesn't 'boost' or adjust clocks based on temperature like a PC does. Of course power draw increases with voltage and clock. It also increases depending on the specific load (is it hammering all the ALU's, or the cache, or running a tight loop that is not impacting much of the SoC circuitry). Whereas PC's adjust clock speeds (and the voltage needed to support them) based on 1) available thermal headroom and 2) CPU load, the PS5 targets a set power draw and varies clocks to sustain that across a range of CPU loads. It can also adjusts GPU and CPU clocks (under developer control) based on the desired power split between them (some games are CPU limited, some are GPU limited), but within the total set power draw for the SoC.Again Power, voltage and temperature are interrelated and you cannot affect one without affect the others ..... If you allow the power draw to be the same while putting a smaller less efficient cooling solution on it the temps are going to skyrocket ..... I guarantee they also use thermal throttling, if not these things aren't going to last very long (Plus thermal throttling is built into the Zen 2 architecture)
I base that on 27 years experience as an electronics engineer and 35 years experience on the x86 platform which is what a PS5 is now
You crossed the line between console and PC with those requested changes.Yeah but that just needed the thermal paste reapplied and possibly a better fan, though I think it was more about the paste. /s.
Fixed mine ty YouTube.
I agree though this is a stupid move. No one wants less cooling. All we want is less problems and more storage. I want 2tb minimum. Or no storage, and let me go buy the drive I want running my games, while receiving a nice discount of the initial box.
They could tube that heat sink. 2 holes each side leading out. Then a possibility to sell an after market external rad for water cooling.
Have I? Will there not be a moment when it all becomes one, shut up spice girls.You crossed the line between console and PC with those requested changes.
A Console is a console until it becomes a PC...Have I? Will there not be a moment when it all becomes one, shut up spice girls.
I like modular PSUs there's a box, connect what you want.
I want a PC or console that does the same. You don't open it. You just connect mods to it. Swap out for upgrades. Ram is a cylinder as is storage etc.
Sata and docking bays I thought would be the start of it and everything went pcie lanes. M.2 etc.
I liked the idea of switching a master HDD depending if I wanted to go windows, Ubuntu, mint, or in 2028 PlayStationOS.
I want a mongrel hybrid.
The higher heat output out the back means that heat is being blown out and not diffusing through the chassis. So it's obviously working.Biased or not, I feel the lost of heatsink size tends to negatively impact cooling. Assuming the new fan does improve airflow, I don't think it can fully make up for the simpler heatsink. I feel the only benefit with the new heatsink design is because there are less fins making it easier for air to pass through. So overall, assuming same fan used, airflow may improve somewhat. Just my guess here. But I think it is worth a relook at thermals and noise with this new heatsink.
As a PS fan, this is looks bad for PS5 and Sony.
But let's get some things straight:
1. A few degrees hotter is not gonna kill the PS5, or thermal throttle it. They can just increase the fan speed if that's the case, so it would be louder.
2. They reduced the heatsink size quite a bit, but made the fan blades bigger (something this article does not say, but you can find the info on other sites and also look at the pictures).
3. Austin Evans is a known Xbox shill and he did not do a proper test, so that is that.
4. I'll wait for other non-biased testers, mainly Gamer's Nexus to prove these findings are correct or wrong, before giving my final judgement.
Nevertheless the fact that Sony did this and they themselves did not come 1st with the explanation and testing to prove it's not an issue, gave MS and their shills free ammunition to shoot at Sony and PS5. So it's Sony's fault 100%.
There is a reason I don't buy consoles when they launch, but after the Slim model comes or even as late as Pro model. I can wait for better versions.
P.S. I have QuantumP. blocked for a reason. He's not worth the wasted time of a reply.
What?! Sony was able to redesign the fan to be more efficient!? How dare they!!!
The higher temp coming out of the back means more heat is blowing out and not being diffused through the chassis.
I mostly agree with what you said except:1. Greater heat is known to shorten the life-span of all electronics and silicon. It's difficult to say if this will happen within the usable life of a console. That's the question. Will this come into play within, say, 5 years? Unlikely. 10? Possibly. 15? Probably. In the future, it's likely this will be the "revision to avoid" for PS5 collectors.
2. The fan shroud is the same size and weight. The angle and number of the blades is different, which probably changes the cooling profile a bit. Based on a sample of 1, it appears the sound profile is slightly dampened, which may mean the fan is able to cool slightly more efficiently...cooling about the same without producing as much noise. In any case, it doesn't appear to make up for the loss of heatsink material.
3. Austin isn't a "Xbox shill." That's ridiculous. He even brought in the dude from the PSReady channel to do the teardown, likely in anticipation of such accusations. Is the PSReady guy a "Xbox shill" too?
4. There's nothing wrong with waiting for more teardowns. But, based on the way you seem to be approaching this it sounds like you would be a perfect candidate for Sony PR telling you not to believe your lying eyes.
This is pretty straight forward. They appear to have reduced the cooling unit size by almost half and taken out 80-90% of the copper. Fanboy nonsense aside, no one in their right mind would say this somehow "good" for the consumer.
There is one thing we can agree on: waiting for a real slim revision with a SOC using more advanced lithography is even more important now. If someone can't get a launch model it would be better to wait. Personally, I always planned on waiting as I find the monstrous physical design of the PS5 to be gaudy/tacky and won't put that thing in my entertainment center. Making the cooling system worse just further reinforces that decision.
The real takeaway is that without airflow data, the temperature of the exhaust tells you nothing about how effectively the heatsink operates. Heat flow = temp plus airspeed, we only have temp. If the airspeed is the same and power is the same, then higher exhaust temp would imply the heatsink is actually performing better because it is drawing more heat away from the SoC and into the exhaust airflow, which would reduce SoC temperatures.This is a wrong assumption.
If you move more air through a heatsink that outputs the same amount of heat the air temperature will decrease because the energy density in the air that is exhausted goes down.
Yet, according to your logic the cooling would be "worse."
So, a higher air temperature out the back could also indicate that there is less air moving...or that the system is simply outputting more heat.
The upshot: temperature of the air exiting a cooler does not tell you anything about the effectiveness of the cooler without some other information.