VIA processors, embedded chipsets and all key platform silicon are validated for this enhanced embedded environment
Taipei, Taiwan, 2nd November 2006 - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced full processor platform support for the new Microsoft® Windows® Embedded CE 6.0, with Board Support Packages (BSP) to be released this month.
The spectrum of embedded design is growing and diversifying, and today embraces a wide range of consumer devices as well as industrial and commercial systems. This new generation of embedded developers will greatly benefit from the enhanced processing performance, newly integrated toolset and more flexible kernel of Windows Embedded CE 6.0, which helps to optimize embedded devices for Internet Protocol, wireless and GPS connectivity, and delivers stable, real-time operation for critical industrial and medical use.
This broader scope of embedded device applicability has created demands for greater performance, richer digital media and extended connectivity at minimal extra power draw. As a leading supplier of x86 silicon to the embedded industry, VIA has integrated more functionality into every component of its processor platforms, while maintaining small, manageable footprints and industry-leading low power consumption. The latest VIA C7® and VIA Eden® processors were designed specifically for this market, scaling up from 400MHz to 2.0GHz with unbeatable performance per watt, while the highly acclaimed VIA EPIA Mini-ITX and Nano-ITX mainboards are especially favored as off-the-shelf development platforms, and VIA’s Mini-ITX form has been widely adopted by the embedded industry.
“The embedded industry is increasingly feeling the pressure of having to design more sophisticated, differentiated devices with greater performance, yet slashing time to market, and it needs the best tools to achieve these objectives,” said Epan Wu, Deputy Director of CPU Product Marketing, VIA Technologies, Inc. “Together with VIA’s power efficient processor platforms, Microsoft Windows Embedded CE 6.0 provides a powerful, flexible and easy to use platform that will help fuel the rapid growth of the embedded market.”
More information about VIA’s power efficient embedded processor platforms may be found at: www.via.com.tw/en/products/embedded/, while further details on Microsoft Windows Embedded CE 6.0 may be found at: www.microsoft.com/windowsce.
Taipei, Taiwan, 2nd November 2006 - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced full processor platform support for the new Microsoft® Windows® Embedded CE 6.0, with Board Support Packages (BSP) to be released this month.
The spectrum of embedded design is growing and diversifying, and today embraces a wide range of consumer devices as well as industrial and commercial systems. This new generation of embedded developers will greatly benefit from the enhanced processing performance, newly integrated toolset and more flexible kernel of Windows Embedded CE 6.0, which helps to optimize embedded devices for Internet Protocol, wireless and GPS connectivity, and delivers stable, real-time operation for critical industrial and medical use.
This broader scope of embedded device applicability has created demands for greater performance, richer digital media and extended connectivity at minimal extra power draw. As a leading supplier of x86 silicon to the embedded industry, VIA has integrated more functionality into every component of its processor platforms, while maintaining small, manageable footprints and industry-leading low power consumption. The latest VIA C7® and VIA Eden® processors were designed specifically for this market, scaling up from 400MHz to 2.0GHz with unbeatable performance per watt, while the highly acclaimed VIA EPIA Mini-ITX and Nano-ITX mainboards are especially favored as off-the-shelf development platforms, and VIA’s Mini-ITX form has been widely adopted by the embedded industry.
“The embedded industry is increasingly feeling the pressure of having to design more sophisticated, differentiated devices with greater performance, yet slashing time to market, and it needs the best tools to achieve these objectives,” said Epan Wu, Deputy Director of CPU Product Marketing, VIA Technologies, Inc. “Together with VIA’s power efficient processor platforms, Microsoft Windows Embedded CE 6.0 provides a powerful, flexible and easy to use platform that will help fuel the rapid growth of the embedded market.”
More information about VIA’s power efficient embedded processor platforms may be found at: www.via.com.tw/en/products/embedded/, while further details on Microsoft Windows Embedded CE 6.0 may be found at: www.microsoft.com/windowsce.
