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VIA Delivers First Single-Chipset Solution for UMPCs

By Julio Franco
Jul 6, 2006
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  1. Taipei, Taiwan, July 6 2006 - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced the VIA VX700 chipset to build on the success of the VIA Ultra Mobile platform in UMPC devices, enabling reduction of mobile form factors by up to 40%.



    UMPCs (Ultra Mobile PCs) is an exciting new category of devices that can fit comfortably into a pocket or handbag enabling users to access and interact with their entire digital world wherever they go. Creating exciting opportunities for entertainment, productivity, and communication focused products the VIA VX700 is the next step in this mobile future, enabling smaller form factor “computing” devices with reduced power consumption and enhanced functionality. As the first single chip implementation of its kind for ultra mobile devices, the VIA VX700 continues VIA’s history of chipset innovation and blazes a strong path for a new breed of digital companions.



    “The VIA VX700 sets a new industry milestone for functionality and performance in a single chipset package,” commented Chinhwaun Wu, Special Assistant to the President, Processor Platform Product Marketing, VIA Technologies, Inc. “Together with the VIA C7®-M processor, VIA can now offer a platform that breaks form factor barriers while maintaining comprehensive performance, a leading feature set, and ultra-low power operation for longer battery life.”



    Leading the way into a new category of Ultra Mobile devices is DualCor Technologies’ cPC, a revolutionary new mobile computing device that brings together all the capabilities of a personal computer and a mobile communications device in a sleek but rugged, handheld form factor.



    “The VIA VX700 chipset together with the VIA C7-M ULV processor has enabled us to create a new convergence device that combines the convenience of a digital communications device, with the power of a conventional PC in a thin, elegant machine,” commented Rob Howe, President of DualCor Technologies, Inc. “The VIA Ultra Mobile platform featuring the VIA VX700 has been critical in helping us achieve the cPC’s small size and enhanced battery life, while still providing the performance that today’s mobile user needs for everyday PC tasks.”





    Ground-Breaking Single-Chipset Design

    The VIA VX700 breaks new ground by enabling platforms for the smallest, coolest and lightest systems. Designed specifically for today’s ultra thin’n’light notebooks and ultra mobile devices, the VIA VX700 integrates all the cutting-edge features of a modern chipset's North and South bridges into a single chip package measuring just 35mm x 35mm, generating a silicon real estate saving of over 42%.



    Rich Feature Integration

    A host of leading digital media, memory and connectivity technologies are packed into the single-chip package of the VIA VX700:

    · Graphics – Enhanced video quality is provided through the proven VIA UniChrome™ Pro II IGP core with its 128-bit 2D/3D graphics

    · Chromotion Video Engine - Powerful image enhancement technology delivering a Hi-Def™ visual experience including advanced video acceleration for MPEG-2, MPEG-4, and WMV9

    · Memory Support– VIA's renowned memory controller technology has been incorporated into the VIA VX700, with support for both DDR and the latest low power high-bandwidth DDR2 memory modules. This includes support for 32-bit DRAM modules enabling a further reduction in form factor.

    · Audio – Integrating the VIA Vinyl HD Audio controller supporting up to eight high definition channels delivering a richer all-round digital media experience

    · Connectivity – Broad connectivity comes with support for SATA II and PATA drives, six USB2.0 ports, and four PCI slots

    · Display – Flexibility is extended to display technologies, with the VIA VX700 integrating a multi-configuration LVDS/DVI transmitter for connection to LCD, and CRT/HDTV interfaces



    Product Availability and Pricing

    The VIA VX700 is expected to be available in volume quantities later in Q3 2006. Pricing is available upon request. For more information on the VIA VX700, please visit the VIA website at: http://www.via.com.tw/en/products/chipsets/v-series/vx700/



    About DualCor Technologies

    DualCor Technologies (www.dualcor.com) was founded in 2001 and is based in Scotts Valley, Calif. The company has been developing a new hand-held communicating personal computer, data server and personal digital assistant: the DualCor cPC. In July 2005, DualCor was awarded the first of nine linked U.S. Patents, encompassing 345 separate claims for its technology. The DualCor cPC is expected to be available in the first half of 2006. www.dualcor.com



    About VIA Technologies, Inc.

    VIA Technologies, Inc. (TSE 2388) is the foremost fabless supplier of market-leading core logic chipsets, low power x86 processors, advanced connectivity, multimedia, networking and storage silicon, and complete platform solutions that are driving system innovation in the PC and embedded markets. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs, motherboard vendors and system integrators. www.via.com.tw
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