Ground-breaking high performance all-in-one x86 chipset for ultra compact embedded systems underscores VIA’s leadership in x86 miniaturization and integration, garners broad industry support

Fremont, California, 4th April 2006 - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced the VIA CX700 digital media IGP chipset for the VIA C7® and Eden® processor platforms, the most advanced x86 embedded chipset that integrates all the cutting-edge features of a modern chipset’s North and South bridges, including rich video graphics, HD audio, and DDR2 and SATA II support, into a single, compact and highly power-efficient package.

Designed specifically for the embedded market and already adopted by leading industry players, the VIA CX700 will be on display at the VIA booth #1145 and partners’ booths at the Embedded Systems Conference show in San Jose, California this week.

Stepping Up the Pace of Miniaturization
The VIA CX700 exemplifies VIA’s design philosophy of reducing the size of the platform in order to enable ever smaller, cooler and lighter systems. In the CX700, VIA has integrated all the key functionality of both the North and South bridges of a regular VIA chipset into a single chip package exactly the same size as a North bridge, i.e. 37.5mm x 37.5mm, representing a saving of over 34% in board real estate. This represents a major breakthrough for the embedded industry where ultra compactness is essential, and will have significant benefit for embedded boards such as PC/104 and VIA EPIA mainboards.

VIA’s Signature Power Efficiency
Complementing the power-efficient VIA C7 and fanless VIA Eden processors it supports, the VIA CX700 is based on a highly sophisticated power efficient architecture that enables such rich integration into a compact package with a maximum power envelope of just 3.5 watts. A number of key power management technologies are incorporated that monitor activity and dynamically control power according to system load requirements.

Designed for Embedded
Targeted for key embedded applications such as Point of Sales (POS) equipment, industrial PCs (IPC) and ultra compact, low power desktop systems such as thin clients, the VIA CX700 has been designed from the ground up to deliver excellent performance, features and power efficiency. The reduction in board space and operating power requirements together with the extensive multimedia, memory, connectivity and display flexibility provides embedded customers with the ideal chipset to take their ultra compact systems to the next stage.

Product Availability and Pricing
The VIA CX700 is expected to be available in volume quantities later in Q2 2006. Pricing is available upon request.
Further information about the single-chip VIA CX700 digital media IGP chipset may be found at the VIA website at:
http://www.via.com.tw/en/products/chipsets/c-series/cx700/.