Cooler Master brings new NanoFusion compound to market

By Justin Mann on December 28, 2005, 12:04 PM
Cooler Master is introducing their new NanoFusion Thermal Grease. When it comes to a performance system, proper use of thermal materials makes or breaks everything, from airflow to heatsinks to fans to thermal compound. In this case, Cooler Master is claiming that their new compound is more efficient than the current most popular type, with a very low thermal resistance. They post their own specifications, and while the drops are minimal at best, often even minimal means everything to an overclocker. How it will actually perform in real life scenarios remains to be seen.

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