Intel released Ivy Bridge earlier this year and although we aren’t expecting its successor until next year, it’s never too early to discuss when more details emerge. CPU World claims to have the latest on the package options we can expect to see from Haswell which includes CPU core count, graphics tier level and the number of memory channels (in that order) that will be available.
The publication notes that Intel will use 4+2+2 and 2+2+2 package options for desktop chips – none (at least initially) will feature the highest graphics, tier 3. All chips will use an LGA package and support DDR3 memory up to DDR3-1600 with a maximum capacity of up to 32GB.
|Mobile (performance)||4||GT3||2||BGA||32 GB|
|Mobile (mainstream)||4||GT2||2||BGA / rPGA||32 GB|
|Mobile (mainstream)||2||GT2||2||BGA / rPGA||16 GB|
|Mobile (ULT)||2||GT3||2||BGA||16 GB|
|Mobile (ULT)||2||GT2||1||BGA||8 GB|
On the mobile side, processors will be available in 4+3+2, 4+2+2 and 2+2+2 packages. We are hearing that processors with the highest level of graphics will only be available in BGA packages. This means it won’t be possible to upgrade notebooks using tier 1 or tier 2 graphics to a tier 3 chip. Furthermore, tier 3 chips won’t be upgradable to faster tier 3 processors. All mobile chips will have two memory controllers and support either 16GB or 32GB of total RAM.
The Ultra Light and Thin (ULT) processor category (which probably means Ultrabooks) will consist of dual-core only CPUs. One package will use the highest tier graphics while the other will use the mid-grade tier. Both will be built using the BGA package with maximum RAM set at 8GB for the mid-range package and 16GB for the higher-end package.