US chipmaker Advanced Micro Devices (AMD) is scheduled to deliver chip samples using a 90nm manufacturing process on 8-inch wafers in the second quarter of next year, Christopher Bode, manager for AMD’s AMP (automated precision manufacturing) development, said in Taipei yesterday.

The chip samples will be cranked out from AMD’s Fab 30 in Dresden, Germany. The fab, which uses a 0.13-micron process, will migrate to 90nm in the second half of 2004, Bode said.

Read more: Digitimes (http://www.digitimes.com/NewsShow/Article.asp?datePublish=2003/12/10&pages=A7&seq=42).

Seems those 0.09 chips won't be running as cool as first predicted.

Taken from http://www.xbitlabs.com/news/cpu/display/20031215184404.html

According to currently available details, maximum current (IDD) of future 64-bit processors from AMD will be 80A, while maximum thermal power will be 105W. These are mandatory requirements for mainboards in the second half of the year.