Sunnyvale, CA—December 3, 2007—OCZ Technology Group, Inc. a worldwide leader in innovative, ultra-high performance and high reliability memory and computer components, today released a unique thermal compound, Freeze, to their line of premium cooling products. Using the latest innovations in thermal management compounds, OCZ Freeze has higher heat conductivity potential than leading silver-based thermal pastes on the market today, offering an ultra-reliable solution for all computing environments.
Based on a proprietary formulation of thermally conductive ingredients, OCZ Freeze can lower CPU core temperature as much as ten percent when compared to conventional silver-based compounds that are a popular choice amongst enthusiasts. OCZ Freeze compound helps maximize overclocking results by reducing the thermal barrier between the CPU and cooler, giving you a performance edge during the toughest computing situations.
“Cooling efficiency of any heatspreader or cooler is determined largely by the removal of the heat from the source,” commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology. “Transfer rates are highly dependent on the thermal conductance of any interface material along with its spreadability—the higher the spreadability, the thinner the interface layer will be, resulting in better heat transfer between the IC and the cooler. The new Freeze Extreme Conductivity Thermal Compound, based on a novel formula of environmentally-safe, non-silver based components, combines low viscosity with high thermal conductivity for superior performance compared to even our own leading products.”