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IBM, 3M team up to build 3D semiconductors with 'glue'

Discussion in 'TechSpot News and Comments' started by Shawn Knight, Sep 7, 2011.

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  1. Shawn Knight TechSpot Staff Posts: 1,667

    IBM and 3M have announced that they will co-develop a special adhesive material that will allow silicon to stack in a tower configuration and will be packaged on 3D semiconductors.…

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    Shawn Knight, Sep 7, 2011
    #1

  2. Guest

    That is awesome, but jesus that would be an expensive chip, its expensive enough for a 40mm2 silicon chip. These would take wafer upon wafer of silicon to make :/
    Guest, Sep 7, 2011
    #2

  3. Guest

    better to levitate with electromagnetism.
    Guest, Sep 7, 2011
    #3

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