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The Eden X2 is built on a 40nm process using a VIA's NanoBGA2 package measuring 21mm x 21mm with a die size of 11mm x 6mm. That die is home to two 64-bit Eden processing cores which supposedly offer "enhanced multitasking and superb multimedia performance." Although VIA doesn't cite any specific benchmarks or examples in its press release, they provided a list of product highlights:
VIA is showing the chip during the Embedded World 2011 conference in Nuremberg (hall 12, booth 574 if you're attending). The Eden X2 is already in the sampling phase and should appear in systems and motherboards by the second quarter of this year. We haven't seen any specific details regarding OEM customers or upcoming products and we suspect that the chip will go largely unnoticed.
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