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01-29-2003, 09:05 AM
http://www.via.com.tw/en/images/Products/C3_cr_L.gif
From VIA Technologies, Inc. (http://www.via.com.tw/en/viac3/c3.jsp):
Introducing the new generation VIA C3 ™ processor integrating the "Nehemiah" core. With its powerful PadLock™ Data Encryption Engine, the new VIA C3 is the first native x86 processor on the market with embedded security features that enhance the protection of sensitive corporate and personal data. The processor is based on an advanced new CoolStream™ architecture that delivers all the necessary performance for running even the most demanding digital media applications while maintaining ultra low levels of power consumption and effective heat dissipation - making it the ideal solution for powering a new wave of innovation in secure, quiet running, small form factor PCs and digital entertainment devices.
Industry leading 0.13 micron manufacturing process
Enables Cool Processing by minimizing power consumption and heat generation while maximizing total system cost efficiency.
PadLock Data Encryption Shield
First x86 processor on the market to feature built-in Hardware Random Number Generator
Highly efficient CoolStream architecture
World's smallest x86 processor die size of 52mm2.
Ultra low power consumption
Industry leading typical power consumption of a mere 11.25 watts.
Ultra low heat
Low heat, so less active cooling is required. Ideal for quiet and silent PC designs.
Clock speeds of 1GHz and beyond
Superior digital media and productivity application performance.
16 Pipeline Stages
Faster CPU speed and efficiency.
StepAhead Advanced Branch Prediction
Looks ahead and gathers the data needs to optimally run applications
Efficiency enhanced 64KB Full-Speed Exclusive L2 cache with 16-way associativity
Improved memory and streaming performance
SSE Instructions
Enhanced 3D and multimedia performance
Full Speed FPU
Additional processing power for 3D graphics, multimedia, and streaming functions
IO/APIC support in future versions
Dual processing support
Full x86 Operating System & software application compatibility
Leverages the richest and most cost-effective software development platforms, including Microsoft® Windows® and Linux.
EBGA/Socket 370 package
Affordable, Low power and small footprint platform
http://www.via.com.tw/en/images/Products/Coolp_L.gif
From VIA Technologies, Inc. (http://www.via.com.tw/en/viac3/c3.jsp):
Introducing the new generation VIA C3 ™ processor integrating the "Nehemiah" core. With its powerful PadLock™ Data Encryption Engine, the new VIA C3 is the first native x86 processor on the market with embedded security features that enhance the protection of sensitive corporate and personal data. The processor is based on an advanced new CoolStream™ architecture that delivers all the necessary performance for running even the most demanding digital media applications while maintaining ultra low levels of power consumption and effective heat dissipation - making it the ideal solution for powering a new wave of innovation in secure, quiet running, small form factor PCs and digital entertainment devices.
Industry leading 0.13 micron manufacturing process
Enables Cool Processing by minimizing power consumption and heat generation while maximizing total system cost efficiency.
PadLock Data Encryption Shield
First x86 processor on the market to feature built-in Hardware Random Number Generator
Highly efficient CoolStream architecture
World's smallest x86 processor die size of 52mm2.
Ultra low power consumption
Industry leading typical power consumption of a mere 11.25 watts.
Ultra low heat
Low heat, so less active cooling is required. Ideal for quiet and silent PC designs.
Clock speeds of 1GHz and beyond
Superior digital media and productivity application performance.
16 Pipeline Stages
Faster CPU speed and efficiency.
StepAhead Advanced Branch Prediction
Looks ahead and gathers the data needs to optimally run applications
Efficiency enhanced 64KB Full-Speed Exclusive L2 cache with 16-way associativity
Improved memory and streaming performance
SSE Instructions
Enhanced 3D and multimedia performance
Full Speed FPU
Additional processing power for 3D graphics, multimedia, and streaming functions
IO/APIC support in future versions
Dual processing support
Full x86 Operating System & software application compatibility
Leverages the richest and most cost-effective software development platforms, including Microsoft® Windows® and Linux.
EBGA/Socket 370 package
Affordable, Low power and small footprint platform
http://www.via.com.tw/en/images/Products/Coolp_L.gif
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