dividebyzero
Posts: 4,840 +1,271
Since there doesn't seem to be a great deal of concrete information around on the X58/LGA1366 successor, I thought I'd repost this from VR-Zone.
X68 is supposedly looking at a three year lifecycle -around the same lifespan as the chipset it is replacing:
Note that the chipset is called Romley - this is the server version for the LGA2011 socket as opposed to the desktop part.
Salient details are:
-Quad channel memory DDR3-1333 (8 DIMMS, 256Gb max). Desktop parts are expected to conform to quad-channel DDR3-1600/4DIMM presumeably 4x8Gb max.
Lane assignments:
2 x PCI-Ex16 Gen 3.0 @ 1 @16 x or 2@8x
1 x PCI-Ex16 Gen 3.0 @ 4x
+ 8 PCI-E 2.0 lanes split between PCI/PCI-E x1 and I/O (14 x USB2.0, 4 x SATA 3Gb, 2 x SATA 6Gb, ONFi, GbLAN and HD Audio)
The main difference between LGA2011 and LGA1155 are obviously the quad channel memory (as opposed to dual channel) and the use of PCI-E 3.0 spec over 2.0 in LGA1155. Effectively double the bandwidth (97% greater)
Servers will exchange the four lane DMI PCIe 2.0 interface for PCIe 3.0 spec. SATA 6Gb increased to 4 or 8 ports and SAS 6Gb compatible. PCI-E lanes increased from 24 to 40 -Utilised as: 2 x PCIe x16 3.0 (@ x16), 1 x PCIe x16 3.0 (@ x4), 1 x PCIe x8 3.0 (@ x4) in the Fujitsu board outlined, in addition to 1 x PCIe x16 2.0 (@x4) and 2 x PCI
TDP for desktop parts is <80 - 130w, and <80 to 150w for server (Xeon).
And some fuzzed out shots of an MSI board showing the DIMM configuration of two either side of the socket
X68 is supposedly looking at a three year lifecycle -around the same lifespan as the chipset it is replacing:
Note that the chipset is called Romley - this is the server version for the LGA2011 socket as opposed to the desktop part.
Salient details are:
-Quad channel memory DDR3-1333 (8 DIMMS, 256Gb max). Desktop parts are expected to conform to quad-channel DDR3-1600/4DIMM presumeably 4x8Gb max.
Lane assignments:
2 x PCI-Ex16 Gen 3.0 @ 1 @16 x or 2@8x
1 x PCI-Ex16 Gen 3.0 @ 4x
+ 8 PCI-E 2.0 lanes split between PCI/PCI-E x1 and I/O (14 x USB2.0, 4 x SATA 3Gb, 2 x SATA 6Gb, ONFi, GbLAN and HD Audio)
The main difference between LGA2011 and LGA1155 are obviously the quad channel memory (as opposed to dual channel) and the use of PCI-E 3.0 spec over 2.0 in LGA1155. Effectively double the bandwidth (97% greater)
Servers will exchange the four lane DMI PCIe 2.0 interface for PCIe 3.0 spec. SATA 6Gb increased to 4 or 8 ports and SAS 6Gb compatible. PCI-E lanes increased from 24 to 40 -Utilised as: 2 x PCIe x16 3.0 (@ x16), 1 x PCIe x16 3.0 (@ x4), 1 x PCIe x8 3.0 (@ x4) in the Fujitsu board outlined, in addition to 1 x PCIe x16 2.0 (@x4) and 2 x PCI
TDP for desktop parts is <80 - 130w, and <80 to 150w for server (Xeon).
And some fuzzed out shots of an MSI board showing the DIMM configuration of two either side of the socket