The bumping of the vcore for the jan 9 release was merely a musing on my part as they seem to have some pretty good OC room left in them.
True enough if AMD bin the 1100+M GPU's for 7970, and everything less as 7950. Which kind of begs the question; How much variability is there in TSMC's 28nm process, and what kind of yield are AMD getting for the top bin ? Remember that AMD are yet to set aside binned low-vo CPU's for the 7990.
the bigger point was that what I heard (as i said) from a usually reliable source, was that the throttling may have been a bit off and premature on the initial round of samples.
Should be easy enough to ascertain even removing the vagaries of non-standard game settings, simply by noting power consumption at full load. The card is presently pulling 264-270w under max load. It would be helpful if the sites that have already reviewed will do so again...on the plus side, there's probably not a lot of graphics hardware coming out so sites may jump at the chance for review page views, on the minus side- some sites wouldn't do much more than an update (two full reviews on the exact same product smacks of company PR) unless it's bundled with a 7950 / CFX review.
if true, this would hurt performance to some degree. I think it will be interesting to see if the performance is bumped up a bit when they reappear on jan 9th. I hold out this possibility as the review samples were handed out with an eyedropper....I don't think they were done binning these things yet:haha:
Possible. New process is bound to give better results as it matures, but generally, vendors don't give out gimped samples for review, and I would have thought that PC Partner would have done some preliminary binning of the cards on hand. Three weeks between paper launch and actual launch suggests that all the launch and review cards are of the same tranche of wafers and the delay is more a product of getting the cut dies into a GPU package and on the boards.
At any rate I will be watching for slightly different results from the jan 9th round of benches to see if this theory was correct.
As will I.
As far as the vcore needed/used, with the paper (get them on the books by end of year) launch. who knows what might come out of a completed binning process
I'm not expecting this series to differ much from the previous (HD6/5/4xxx) series tbh.
Average bins for reference based cards made by PC Partner with AIB's stickers plastered to them.
Low bins for AIB budget money-makers (fewer PCB layer count, budget power componentry)
High bins reserved for vendor OC special editions, with a trickle of low voltage optimized GPU's for the duallie 7990.
For me, a good indicator of how good the arch/process is, is how many salvage parts materialize:
40nm early: HD 5850 at launch, HD 5830 originally unannounced-arrives midway through the product cycle
40nm late : HD 6950 at launch, HD 6930 originally unannounced-arrives very late in the product cycle
28nm early: HD 7950 at launch, HD 7890 all but announced for one quarter after launch.