Samsung Electronics has developed the world's first eight-die multi-chip. The package, which offers a combined capacity of 3.2 gigabits in a package that is 1.4 mm thick, can apparently be easily integrated in high capacity mobile devices such as 3G handsets and other increasingly smaller mobile devices.
Such power... but what to use it for? Well, Samsung believes that the technology is likely to trigger development of new next-generation mobile applications - all at a time where industry experts predict that that the 3G mobile phone market will expand at an average of 87 per cent a year.
Samsung used Wafer Supporting System technology to make the wafers thinner during design processing. It thus was able to minimize overall chip thickness as well as decrease the space between the stacked dies.
The new eight-die MCP uses the memory chips available today for mobile products in a single 11 x 14 x 1.4 mm package. It includes two 1 GB NAND flash memories, two 256 MB NOR flash memories, two 256 MB mobile DRAMs, one 128 MB UtRAM and one 64 MB UtRAM.