A promotional image for Huawei’s upcoming Mate 9 smartphone seemingly confirms a couple of previously leaked hardware components.
The image in question notes that the Mate 9 will feature HiSilicon’s Kirin 960 SoC and a dual 20-megapixel rear camera system.
If true, Huawei’s Mate 9 could be among the first handsets to utilize HiSilicon’s Kirin 960 SoC. That wouldn’t be unprecedented as HiSilicon chips have debuted in Huawei-branded phones in the past.
As Android Authority notes, not much is known about the Kirin 960 although most believe it’ll consist of four Cortex-A73 cores and four low-power Cortex-A53 cores in a big. LITTLE configuration built on TSMC’s 16-nanometer manufacturing process.
The dual 20-megapixel rear camera system, meanwhile, is expected to be certified by Leica (much like the Huawei P9) although it’s unclear exactly how Huawei will use the two cameras. We can also see that there appears to be a fingerprint sensor on the rear of the device just under the camera and flash assembly.
GSM Arena further believes that the Mate 9 will feature 6GB of RAM and ship running Android 7.0 Nougat with an Emotion UI 5.0 overlay.
Keep in mind that the authenticity of the promo image can’t be verified but its advertised specifications do line up with earlier rumors.
Huawei is expected to announce the Mate 9 by the end of the year, likely in time for the holiday buying season.