Hey gang, I figured there may be a few of these purchased by TS members so Thought I would give a heads up. I read about the PWR/NB/SB heatpipe/heatsink assembly standoffs being the incorrect height and not allowing full contact to the chipsets. I checked mine out of the box and indeed it was the case of the one I purchased 7/16 or so. Many are getting them this way and filing,grinding, or milling them down. I milled them down .0625 inch and it left a flush Thermal compound pattern. you do not have to be hyper precise as the screws from the back of the MB are spring resisted, but you do need to take enough off. I would suggest at least checking this before assembly if only to replace the deplorable thermal pad they put on it from the factory. The difference for the boards with the bad standoffs and the correct ones (or fixed) is around 35C.