The .6mm-package contains eight 30nm, 32Gb NAND flash chips, each measuring only 15um (.015mm) thick. This super thin multi-die memory package overcomes the conventional technology limits of a chip's resistance to external pressure when under 30um in height, and will allow for double the density of previous multi-chip packages, according to Samsung. The company has not publicly named any customers for the new product, but I imagine they'll find a home in various gadgets soon enough.
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