Samsung has developed a new technology that can reduce space requirements and increase performance capabilities of today's multi-chip packages. This can be used to increase the performance of Flash memory.

Rather than using wire-bonding, Samsung has created micron-sized holes that penetrate through the silicon vertically to connect circuits directly. As a result, there is no need for gaps of extra space and wires protruding beyond the sides of the die. The company claims that the WSP is 30% thinner a comparable MCP; footprint space savings are claimed to be about 15%.
Samsung believes that the technology will enable manufacturers of mobile and consumer electronics devices to achieve better electrical performance. Designs for mobiles, for example, will become slimmer, and high-performance handsets with improved battery time will be the result.