The next batch of flagship smartphones are expected to be powered by Qualcomm’s Snapdragon 823 SoC. Leading the pack, if rumors pan out, could be Chinese-based smartphone manufacturer LeEco (formerly Letv).
According to Chinese media (via WCCF Tech), LeEco is working on an Android smartphone powered by the Snapdragon 823 that’ll be unveiled later this month at Mobile World Congress Shanghai (June 29 through July 1). The device will reportedly carry an Adreno 530 GPU, an X12 LTE baseband and Cat.12 / 13 LTE modem support.
Although unconfirmed, the publication speculates that LeEco’s handset could be the first to ship with 8GB of LPDDR4 RAM and a 25-megapixel camera sensor.
The Snapdragon 823 will reportedly be built on the 14-nanometer FinFET manufacturing process with LeEco’s device shipping with a dual-core 2.15GHz and dual-core 1.6GHz configuration. Power consumption may be an issue for LeEco although hopefully, LeEco will load the phone with a sizable pack to deliver respectable runtime.
If LeEco is the first to announce a Snapdragon 823-powered phone, it may not mean very much if it never comes to market. As Digital Trends recounts, the company was also the first to announce a handset powered by the Snapdragon 820 – the Le Max Pro – but that phone never made it to market.