AMD has said that it will be putting a 3D hologram on its boxed chips using Dupont Izon technology. Sounds nice, and puts one in mind of the kinds of things that adorned the Pentium II processor when it came out. How exactly you will see the thing when its got a heavy heat-sink clamped over it is anyone's guess. However, there may be an ulterior motive.
[AMD]denies that this has anything to do with the reports about defective chips swilling around in the channel, although it is still to comment as promised on the reports.