hahahanoobs
Posts: 5,584 +3,373
Not likely.
1. Intel's (and AMD's for that matter) is moving toward a mobile-centric architecture
2. Smaller node means smaller die and smaller CPU/APU package. Lower power usage on a rapidly shrinking surface area still equates to high localised temps.
3. Core efficiency (cache, branch prediction, memory transfers) takes precedence over core frequency. Branch prediction accuracy usually takes a hit once the power envelope starts ramping up. Accuracy and stability are usually a better trade off against outright speed (see Intel Xeon)
I know all of that. I read tech like old people play the lottery. That's why it's called hope, and I was referring to the K SKU's only.
A first world problem or THE first world problem ?
Easy fix: Unscrew the heatsinks, Cut fresh thermal tape to size. Remove existing thermal pads and clean TIM residue with isopropyl alcohol. Anodize or repaint heatsinks to desired colour. Replace thermal pads and TIM. Carefully refit heatsinks.
I'd rather not, but thanks for your input.