IBM, 3M team up to build 3D semiconductors with 'glue'

By Shawn Knight
Sep 7, 2011
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  1. IBM and 3M have announced that they will co-develop a special adhesive material that will allow silicon to stack in a tower configuration and will be packaged on 3D semiconductors.…

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  2. That is awesome, but jesus that would be an expensive chip, its expensive enough for a 40mm2 silicon chip. These would take wafer upon wafer of silicon to make :/
  3. better to levitate with electromagnetism.

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