Frore unveils thinner, lighter, and smarter version of its AirJet Mini fanless cooler

Shawn Knight

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In a nutshell: Frore Systems has hit the Las Vegas strip with a thinner and lighter version of its AirJet Mini cooling system. The newly minted AirJet Mini Slim builds on the success of the original, which earned a Golden Award at Computex 2023 and a Best of Innovation award at this year's consumer electronic show. The new cooler utilizes the same basic design as its predecessor albeit with three new features.

The AirJet Mini Slim measures just 2.5 mm thin and weighs eight grams, making it 0.3 mm thinner and one gram lighter than before, while otherwise maintaining its same footprint of 27.5 mm x 41.5 mm. The slightly slimmer profile will allow manufacturers to fit it into even tighter spaces in products such as tablets, fanless laptops, and handheld gaming devices.

Frore's new cooler additionally includes a self-cleaning feature to tackle dust, which can lead to operational risks and reduced performance in electronics when neglected. AirJet Mini Slim can reverse its airflow, which the company claims can clear out any accumulated dust from the system's filters.

The new cooler is also able to sense its own temperature through a process known as thermoception. As such, it can optimize its performance autonomously to maximize heat dissipation without thermal sensors in the host device.

Frore Systems highlighted the fact that its AirJet Mini Slim is scalable, meaning one can simply add more units to a product to enhance cooling. A single unit is capable of removing 5.25 watts of heat at 21 dBA, and generates 1,750 pascals of back pressure while consuming just one watt of power.

Frore Systems cites a number of potential use cases for its innovative cooling technology. In addition to traditional and mobile PCs, its products could help cool 3D printers, augmented and virtual reality devices, professional video cameras, mini LED projectors, and 8K televisions.

No word yet on when Frore will have its AirJet Mini Slim system ready to go, or which devices will be the first to feature its new cooling solution.

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"A single unit is capable of removing 5.25 watts of heat at 21 dBA"

What? A $15 Noctua can cool down a 10W Intel SoC in under 10 dBA. What's the point of this gimmick?
 
"A single unit is capable of removing 5.25 watts of heat at 21 dBA"

What? A $15 Noctua can cool down a 10W Intel SoC in under 10 dBA. What's the point of this gimmick?
Compact, noise-free low-TDP designs.

It should be useful in some cases, it's good to see something innovative that doesn't die on paper.
 
"A single unit is capable of removing 5.25 watts of heat at 21 dBA"

What? A $15 Noctua can cool down a 10W Intel SoC in under 10 dBA. What's the point of this gimmick?

This is designed for a completely different use case or environment than a traditional mechanical fan. The point is that they are small and have no moving parts.

Multiple units can also be stacked, so once you start combining 3 or 4 of these you’re getting into cooling 20W parts such as the Apple M chips, which are known to throttle under thermal load precisely because they’re too slim to fit a mechanical fan.
 
This is designed for a completely different use case or environment than a traditional mechanical fan. The point is that they are small and have no moving parts.

Multiple units can also be stacked, so once you start combining 3 or 4 of these you’re getting into cooling 20W parts such as the Apple M chips, which are known to throttle under thermal load precisely because they’re too slim to fit a mechanical fan.
Even the most low-end version of the M2 exceeds 30w, so I think it's difficult to be effective, maybe it helps but not much.
 
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