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Intel becomes the first to demonstrate 3D stacking of logic chips with Foveros

By Shawn Knight · 8 replies
Dec 12, 2018
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  1. Memory makers have been using interconnect techniques like through-silicon via (TSV) to vertically stack chips for years. The practice affords a smaller footprint compared to traditional two dimensional processes and often requires less power, boosting efficiency.

    At Architecture Day 2018, Intel demonstrated a new 3D packaging technology it’s calling “Foveros.” According to Chipzilla, it represents the first time 3D stacking benefits have been applied to logic-on-logic integration. This means that CPU, graphics and AI processors can be assembled vertically atop other components.

    Given the emerging IoT industry and the advent of 5G wireless technology, Foveros could play a major role in the development of next-gen small-form factor devices.

    The first Foveros product, expected in the second half of 2019, will “combine a high-performance 10nm compute-stacked chiplet with a low-power 22FFL base die.” As The Verge highlights, this may be Intel’s way of skirting issues it has had with its 10nm manufacturing process:

    "Intel suggests it will do something it calls 2D stacking, which is a separation of the various processor components into smaller chiplets, each of which can be manufactured using a different production node. Thus, Intel could deliver nominally 10nm CPUs, which will nonetheless have various 14nm and 22nm chiplet modules within them."

    An Intel rep told the publication that Foveros processors will eventually show up in everything “from mobile devices to the data center.”

    Permalink to story.

     
  2. amstech

    amstech IT Overlord Posts: 2,240   +1,441

    Pretty soon CPU's are going to be small cubes!
     
  3. Evernessince

    Evernessince TS Evangelist Posts: 4,008   +3,503

    I guess Intel needed some of that glue as well.
     
  4. Morris Minor

    Morris Minor TS Addict Posts: 110   +54

    Hhhmm cooling going to be a problem?
     
    Aux101 and mosu like this.
  5. GreenNova343

    GreenNova343 TS Maniac Posts: 363   +246

    Kind of sounds like an idea mentioned in Alan Cole & Chris Bunch's book Fleet of the Damned from the Sten Chronicles (#5 in the series). May not be exactly the same in execution, but the principle is the same...& it only took them nearly 30 years to bring it to real life (book was published in 1989, & presented the technology as "ancient" -- which makes sense, given IIRC that the books take place somewhere around A.D. 5000 or so).
     
  6. LNCPapa

    LNCPapa TS Special Forces Posts: 4,281   +527

    [​IMG]
    This is what I want my future CPU to look like.
     
    Right side bob and Jo3yization like this.
  7. Danny101

    Danny101 TS Guru Posts: 772   +294

    CPU 3-D Printing! Hey! Can somebody print me a faster processor? This one's getting slow. What! They released the diagrams yesterday. I needed it printed yesterday!
     
  8. captaincranky

    captaincranky TechSpot Addict Posts: 14,976   +4,010

    Be careful what you wish for, or one morning you'll come down to read your email and it will look like this

    [​IMG]
     
    Morris Minor and LNCPapa like this.
  9. Aux101

    Aux101 TS Enthusiast Posts: 43   +6

    Hum! More competitions usually means lower prices sir!
     

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