This small metal bracket can drop Core i9-12900K temps by 10 degrees

True but the third party are limited in what they can do about Intel's poor engineering and at least they are having a go
Couldn't the mobo partners redo the lid? Would Intel permit that?

How about issuing a recall maybe?

(OK, I am something of a dreamer).
 


 
gimmicks for alder lake?

I don't need more than a dualcore Sandy Bridge

Make one @ 3nm and I will come

No gimmicks required!

Extremely Low power draw yet fast enough for everything I need a computer for

If you need dozens of cores, massive power supplies, extreme heat and gimmicks, then keep going where you're going

You're headed in the right direction
I have no idea what you're talking about.
 
@AlaskaGuy I'm sort of confused how this gem mounts. It looks like it uses the same holes as the HSF. Does it affect the tension of the HSF? :confused:

Oh well, I have a B660 board here which I haven't taken out of the anti-static yet. Maybe I should have a look.

I have a Noctua cooler for it, and I'm wondering if that has the compensating bow in the center.

If this works as advertised and prevents future issues, it looks like a quick, cheap, fast, and dirty, solution. "An ounce of prevention is worth",...um 13 bucks, easy..
 
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@AlaskaGuy I'm sort of confused how this gem mounts. It looks like it uses the same holes as the HSF. Does it affect the tension of the HSF? :confused:

Oh well, I have a B660 board here which I haven't taken out of the anti-static yet. Maybe I should have a look.

I have a Noctua cooler for it, and I'm wondering if that has the compensating bow in the center.

If this works as advertised and prevents future issues, it looks like a quick, cheap, fast, and dirty, solution. "An ounce of prevention is worth",...um 13 bucks, easy..
If you have a thick board then you're already good.
 
If you have a thick board then you're already good.
I'm using Gigabyte, (as I always do). I think they're advertising 2 mm. (?). I know it's "ultra durable". (But I also know that's an advertising tag line, such as it is). ;)

BTW, those were good/interesting links you put up.(y) (Y)
 
I'm using Gigabyte, (as I always do). I think they're advertising 2 mm. (?). I know it's "ultra durable". (But I also know that's an advertising tag line, such as it is). ;)

BTW, those were good/interesting links you put up.(y) (Y)
What model of Gigabyte?
 
And how is Intel's solution working.
"However, the frame isn't necessarily the better product."

It turns out that the helpfulness of the Contact Frame varies with the CPU and cooler depending on how flat they are to begin with. Some CPU coolers made for Alder Lake come from the factory with a slight curve to balance out the bend in the IHS, and Igor's Lab's recent review found that they don't benefit from the Contact Frame.

In their testing with three different models of CPU coolers, Igor's Lab discovered that the frame offered an improvement of 10° C with one, 6° with another, and had no effect with the third.

However, the frame isn't necessarily the better product. Both Der8auer and Igor's Lab warn that it can apply too much pressure to the CPU in the socket, causing it to make a bad connection to the motherboard that can often result in memory instability. The solution to this is to reseat the memory and dial back the pressure by loosening the screws, but it's tedious.
 
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And how is Intel's solution working.
His answer, lmao:
Read the reviews.
Basically, there is no solution from intel.

Because intel customers should accept a flawed product and should accept the bending of their brand new (and expensive? no, it's cheap, right?) Alder Lake CPU and they should accept losing about 10 degrees in thermals efficiency in a matter of months, right?

Because this is NORMAL. And all the shill media is supporting them and we don't see any publication blaming and exposing intel for such ****** practices. Pathetic, like I said.

If would have AMD done this it would have been a ****storm on the internet.

Unbiased and professional (tech) journalism is DEAD.
 
His answer, lmao:

Basically, there is no solution from intel.

Because intel customers should accept a flawed product and should accept the bending of their brand new (and expensive? no, it's cheap, right?) Alder Lake CPU and they should accept losing about 10 degrees in thermals efficiency in a matter of months, right?

Because this is NORMAL. And all the shill media is supporting them and we don't see any publication blaming and exposing intel for such ****** practices. Pathetic, like I said.

If would have AMD done this it would have been a ****storm on the internet.

Unbiased and professional (tech) journalism is DEAD.
The bending is only an issue on thin boards. Now who's that on ... Intel or the board manufactures trying to save a buck.
 
What model of Gigabyte?
A cheapie. B660M-DS3H-DDR4. It's the ;least expensive 4 slot DRAM I could find. When I read the review saying, "the VRM will never hold up when you start overclocking your i7-12700", I knew it was the board for me. (y) (Y) Mercifully, it doesn't have Wi-fi. This is a "mainstream" build, fer shur. I decided years ago, that when Intel, (if ever), got to 10 nm, I would build a new box. So, with Alder Lake,I had to keep that pact with myself and wipe, or quit playing with the bidet..

All I'm really expecting is, that it will outperform my i5-6600 rig noticeably, and be able to handle an NVme C/: drive. At the end of the day., a decent case is the hardest thing to find, with such "old school" accouterments as 5 1/4" and 3 1/2" front drive slots. (I know what you're thinking but, the floppy slot is ideal for installing a USB 3.0 add-in card, especially in older cases). I'll probably, (Almost definitely), build it in one of my "Storm Scout" cases, and buy something else to use with the existing i3-3225 rig.

I bought the standard 12100 model, (with IGP). I have no idea what Intel was thinking with the "F" models, with the graphics card situation the way it was, (and pretty much still is).
 
The bending is only an issue on thin boards. Now who's that on ... Intel or the board manufactures trying to save a buck.
Oh really? How about this silliness:
Some CPU coolers made for Alder Lake come from the factory with a slight curve to balance out the bend in the IHS
So now even some coolers are bent/curved to offset this issue. So which one do you buy and pair it with which motherboard?

Where is the compatibility list of bend cooler for thin MB and straight coolers and thick MB?

Between all these variables of this issue, yeah, no thanks - it's a **** show! AMD does not have this issue, intel does.
 
This is something that AMD is far ahead over intel... CPU socket interface and securement. Leaps and bounds ahead really. Intel should take note.
Exactly why AMD is going with LGA for their next generation of Ryzen CPUs, only took them 20 years to catch up to Intel on that front. But yeah, Intel could learn a thing or two from this right?
 
So now even some coolers are bent/curved to offset this issue. So which one do you buy and pair it with which motherboard?
This is nothing new, this is a practice that goes way back, and it wasn't just applicable to Intel CPUs, one of several reasons to lap your heatsink, although it could be counter productive as well.
 
The amount of copium, apologetics and plain blind fanboism from intel's zombies int this topic far surpases any AMD equivalent in any other topic... It's hilarious.

Intel ***** up, made a bad design. These are facts, not feelings. Take the L, do better in the future. End of story.

No one is taking responsibility for their actions anymore, pathetic.
 
So now even some coolers are bent/curved to offset this issue. So which one do you buy and pair it with which motherboard?
I'm going to "assume", er, or rather make an "educated guess", that aftermarket coolers will be straight,, and the Intel stock coolers with be "bent", since Intel had the lead time on the "issue".. OEMs would have to make theirs straight, since there's no guarantee that they will be going on an Alder Lake system. (Just read the compatibility list on the box).

Now we come to the available "solutions". From what I've gathered, the $45.00 part us pretty much made in a low volume shop.Whereas the $12.00 dollar stiffener is made in a high volume operation, with CnC machines. Dollars to donuts, the difference between them is negligible.

So, why not just buy the $12.00 part up front? If you have a thick mobo, it isn't necessary., but it won't harm any thing by installing it. If you have a thin mobo, it will, (hopefully) rectify the problem.

If all the money you ever waste on this hobby is $12.00, consider yourself incredibly fortunate.

Now, let's look at who's doing all the whimpering about heat, over-clockers. But, aren't they always the ones who are always complaining about heat anyway?

Intel screws them upfront. First of all, I doubt it costs more to produce as "K" model CPU. Plus, they get to save money, by not supplying a stock cooler. So these rabid "enthusiasts", get screwed twice before they even walk out of the store. But they're "happy", despite walking a but funny for awhile..

The same goes for these "F" model CPUs. Those who buy these think they're "getting over", by saving $20.00. Well suppose a VGA card fails? The machine without an IGP, is bricked, until you buy another card. Whereas, I just pull the cable off the card, plug it into the board and party on, while I'm waiting for an add-in card to go on sale. (Not holding my breath, on that happening anytime soon though)..

So, then you claim, "if this happened with an AMD product,, people would be trolling all over the web to trash them". But judging by your.context, and that of many other AMD fanboys here. (and elsewhere),I'm expecting you'd be first in line to defend them, and quite vigorously, I might add..
 
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