don't hold the iron on the board for any more than 2 seconds otherwise you may damage the circuit board.
To make it easier you could use a small amount of super glue to hold the components in place, just don't get it on the solder pads
I agree whith the other things you said, but disagree with this almost entirely.
The two second limit is ficticious, especially with a very fine tip. I do agree that too much heat will damage the circuit board though. More to the point, to much heat will damage an SMT component!
You can leave the heat on the board for a reasonable length of time, but not so long that you loose the pad, and those pads for SMT compoents are VERY easy to loose sometimes. you should apply the heat to the component only for a short a time as possible for the solder to flow around it and stick. I deally, the solder should form a concave surface rising as a slope from the pad to the component. If there is to little solder, it doesn't conduct properly, and too much solder runs the risk of splashes, a weak (hollow) joint, or in rare circumstances, (bearing in mind that many electronic boards are tested and then calibrated after these components are stuck on) a lower resistance.
When soldering these things, you hold them reasonably gently with a tweezers in the center of the component, making absolutely sure that they are flat to the board. If necessary, you need to re-work the pad to get any existing solder off it. For speed, it is best to use a soft solder (60% lead, or higher). whilst holding the component down, heat the pad a little, then lift the iron (a fine tipped iron that is, at a lowis temp wher possible)
without scraping the pad and immediately apply the iron to both the pad and wall of the component.as you do this, provided your iron is warm enough, add a small amont of solder and remove the solder, then the iron, all in one smooth motion if possible, all the time holding that component close to the board. You can then put the tweezers down, and solder the other side. I'm afraid it's a three hand job with these things.
By the look of the image, those components are most likely resistors, but could also be capacitors.
The whole thing should take about 3 seconds per component if you're being careful per component side. Fluxwill help the solder flow better, but as Samstoned said, NO acid flux! And whatever you do, make sure you put the right component in the right place, because those pads DON'T like being reworked more than a few times. I used to do it for a living to varying standards (either military, or aviation. Aviation standard sucked!) Surface Mount Technology wasn't designed for hand soldering, but it can be done if your careful.
One last caution. If you use a solder sucker to remove the excess before or during the operation, whatever you do, don't hit a pad while using it. those things seem almost guarenteed to lift the older pad if you hold them to close, or hit the board with the recoil.
It's not as hard as I've just made it sound, I've just gone into detail, butIt is very important to be careful.