Samsung plans to stack HBM memory on top of CPUs and GPUs arriving in 2025
SAINT-D vertical stacking technology ready just in time for HBM4 debut next year?
3d packaging articles
AI boom could lead to a new GPU shortage, but Nvidia says the current problem is just packaging
Current shortage mostly affects enterprise GPUs, but could spread to consumer cards
New Intel research charts a course to trillion-transistor chip designs by 2030
The research describes Intel's plan to advance 2D transistor and 3D packaging technologies
Intel wants to achieve 1 trillion transistors on a package by 2030 using chiplets
The company has big ambitions with 3D packaging designs, but Meteor Lake CPUs won't arrive until next year