AMD's new AI roadmap spans new Instinct GPUs, networking, software, and rack architectures
New Instinct GPUs deliver 3x faster inferencing, up to 40% better cost per token vs. Nvidia's B200
Enterprise articles
The cloud is not enough: Cisco embraces the shift toward Hybrid AI workloads
Cisco highlights potential of on-prem agents and AI
IBM aims to build world's most powerful, fault-tolerant quantum computer by 2029
IBM Quantum Starling will be ready in 2029
Next-gen E2 SSD packs 1 petabyte of storage, enough for 11,000 4K movies in a ruler-sized drive
Something to look forward to: A revolutionary new SSD form factor could soon redefine high-density storage in data centers by narrowing the capacity gap between mechanical hard drives and solid-state drives. Known as E2, this QLC flash-based drive is reportedly capable of storing up to 1 petabyte (1 million gigabytes) of data while delivering performance comparable to that of a high-end SSD.
New 80 Plus Ruby PSU efficiency rating exceeds Titanium standard, coming to data centers
At least 90% efficiency at all load levels
Oracle invests $40 billion in Nvidia chips to build one of the world's largest data centers
Stargate project aims to transform global AI landscape
Dell embraces silicon diversity in AI server hardware at Dell Technologies World
Also, Dell launches world's first PC with discrete Qualcomm AI accelerator
Nvidia NVLink Fusion delivers 14x more bandwidth than PCIe Gen5 for AI data centers
A performing computing fabric that's essential in Nvidia's plans for AI factories
Sandisk's Stargate SSD architecture targets 512TB drives by 2027
Stargate to debut this year in Ultra QLC 64TB and 128TB models
AI is reshaping chip design tools, and the results are impossible to ignore
Why it matters: As powerful as AI may be, many industries are still struggling to find clear-cut applications that make a measurable, demonstrable difference. Thankfully, that is not the case when it comes to chip design software. In fact, since their introduction just a few years ago, AI-powered features have become a mainstay of EDA (Electronic Design Automation) tools from companies such as Cadence and Synopsys.
World's largest zipper maker YKK shows off self-fastening zippers powered by motors and remote controls
Motorized zippers can reach difficult heights, ideal for industrial and commercial use
Kioxia new optical PCIe 5.0 SSDs can do 40-meter cable lengths with no performance loss
Collaboration with AIOCore and Kyocera targets AI infrastructure
Arm is aiming to win half of data center CPU market by year's end
Nvidia will play a major role in achieving that ambitious goal
Gmail adds end-to-end encryption for internal emails in enterprise beta
Send client-side-encrypted messages with a few clicks
Gartner projects $644 billion in 2025 AI spending, but few understand GenAI's actual value
A paradoxical market forced to grow until it bursts
Google's Colossus internal storage system still relies on HDDs for storing most of its data
But a smart algorithm manages the system's massive cache comprised of SSDs
Mozilla Firefox will soon reduce the need for dangerous DLL injection for enterprise users
Less foreign code means a more stable browsing experience for employees
SAP surpasses Novo Nordisk to become Europe's most valuable company
What just happened? German software giant SAP has overtaken Danish healthcare company Novo Nordisk to become Europe's most valuable company. SAP's stock has performed exceptionally well, rising more than 40 percent over the past year. The firm's success is largely driven by its strategic shift toward cloud-based services and increasing focus on AI, both of which have strongly resonated with investors.
Micron, Samsung, and SK Hynix preview new HBM4 memory for AI acceleration
They're likely too costly for consumer GPUs for now
The biggest barrier to enterprise AI adoption isn't technology - it's training
Enterprises are paying for the tools, but they're missing a key piece of the puzzle
Apple may be working on a custom AI server chip with Broadcom's help
Slated for 2026, Apple would be leveraging Broadcom's 3.5D XDSiP technology
Next-gen Nvidia GPU "Rubin" is ahead of schedule, uses 3nm manufacturing and HBM4
Availability now expected in the second half of 2025
AWS refreshes AI story with new Trainium 2 chip, Bedrock upgrades, and SageMaker Studio
New chips, models, and platform tools
Failover vs. Failback: Two Disaster Recovery Methods
A key distinction in the realm of disaster recovery is the one between failover and failback. Both terms describe two sides of the same coin, complementary processes that are often brought together.
The unsung heroes of chip sales: field application engineers
Solving problems, closing deals