SK Hynix is embedding cooling into HBM memory to stop AI chips from overheating
New iHBM with cooling structures is said to cut thermal resistance by over 30%
Chipmakers on track to meet only 60% of AI memory demand by 2027
AI is eating the memory market and relief is still years away
Samsung and AMD deepen AI memory pact with potential foundry deal on the table
The partnership expands beyond HBM4 supply, signaling AMD may tap Samsung to manufacture future AI chips
Microsoft's Maia AI chip ambitions might include an exclusive SK Hynix HBM3e memory deal
Big Tech buying all the memory chips they can, for years to come
SK Hynix doubles down on high-bandwidth memory with $12.9 billion packaging plant
The new facility will be built in South Korea
Samsung and SK Hynix are jacking up DRAM prices by as much as 70 percent
Hyperscalers and Big Tech are buying every memory chip they can
Samsung pushes HBM4 as it battles SK Hynix for AI memory dominance
2026 will test Samsung's HBM4 bet
Memory and storage prices will only get worse, Adata CEO says
Rising AI demand pushes up prices for DRAM, NAND, SSDs, and HDDs
The big picture: Multiple manufacturers have recently frozen or hiked memory and storage prices as demand from AI data centers surges, and executives warn the situation may get worse before it gets better. Across the industry, AI and cloud giants are displacing traditional memory makers, while DDR4 RAM – once the backbone of PCs and servers – is slowly being phased out. The result is a perfect storm that's upending supply chains and reshaping the economics of the memory market.
Micron ships 11 Gbps HBM4, confirms 40 Gbps GDDR7 in development
Micron also announced a partnership with TSMC
Samsung overcomes technical challenges, ready to supply HBM3E chips to Nvidia
Thermal issues kept Nvidia from signing on sooner
SK hynix edges out rivals with first-to-market HBM4 chips for Nvidia and others
The new chips double the bandwidth with 2,048 input/output terminals
What just happened? SK hynix is preparing to begin mass production of its HBM4 chips, marking a major step forward in memory technology tailored for AI data centers. The South Korean company has completed its internal review and developed faster, more energy-efficient memory that meets rising industry demand. As global AI adoption accelerates, the need for high-speed, power-efficient components to support the expanding data center market continues to grow.
SK Hynix says AI boom will fuel strong HBM chip demand through 2030
Massive investments in AI data centers expected to lift HBM market by 30% each year
SanDisk and SK hynix partner on High Bandwidth Flash, promising up to 16× more memory for AI GPUs compared to HBM
Forward-looking: SanDisk introduced its High Bandwidth Flash solution earlier this year, vowing to bring unprecedented capabilities to the NAND Flash market. Now, the US corporation is working with South Korean foundry SK Hynix to try to turn the HBF dream into reality.
Micron, Samsung, and SK Hynix preview new HBM4 memory for AI acceleration
They're likely too costly for consumer GPUs for now
AI boom fuels semiconductor growth to $626 billion, with 2025 set for more gains
The AI craze has made some companies very, very rich
AI Money: While shareholders and tech giants scramble to turn AI's promises into real-world business opportunities, semiconductor companies are raking in billions. Samsung has emerged as the world's top semiconductor player by revenue, and the industry is poised for another strong year.
Tesla is eyeing HBM4 chips from Samsung and SK Hynix to power its Dojo supercomputer
SK Hynix leads but Samsung chases with 4nm node
In a nutshell: Tesla finds itself at the forefront of a heated competition between South Korean semiconductor giants Samsung and SK Hynix. The electric vehicle manufacturer has reportedly reached out to both companies, seeking samples of their upcoming HBM4 memory chips.
Samsung confirms there are no plans to sell foundry business, issues apology over missed profits
Sorry for the $6.78 billion in operating profits
Nvidia approves Samsung's 8-layer HBM3E chips as the graphics giant races to close gap with SK Hynix
It's an open question what Nvidia thinks of Samsung's 12-layer HBM3E chips, though
Samsung plans to stack HBM memory on top of CPUs and GPUs arriving in 2025
SAINT-D vertical stacking technology ready just in time for HBM4 debut next year?
DDR5 memory prices could rise 20% due to increasing demand for AI chips
The days of dirt-cheap DDR5 RAM may be over soon
SK Hynix confirms plans to bring HBM manufacturing to the US
The $3.87 billion facility will be built in Indiana
Samsung and Micron prep advanced HBM3E 3D chips for memory-intensive applications
HBM3E DRAM will improve generative AI services and reduce costs
SK Hynix on track to deliver HBM3E this year, HBM4 memory for next-gen GPUs in 2026
There will be a significant shift toward customization demand with HBM4
Micron foresees new quarterly losses, bets on HBM3 Gen2 tech and Nvidia partnership for the future
The US chip manufacturer is experiencing its mid-life (business) crisis
HBM4 could double memory bandwidth to 2048-bit
Double the bandwidth could mean double the performance