SK Hynix is embedding cooling into HBM memory to stop AI chips from overheating
New iHBM with cooling structures is said to cut thermal resistance by over 30%
Samsung put Dua Lipa's face on TV boxes without asking. Now she's suing for $15 million
Samsung denies "intentional misuse"
ASML looks beyond EUV, plans new tools for larger chips and 3D packaging
The company is exploring technologies to stack, bond, and scale chips beyond two-dimensional limits
SK hynix merges DRAM and NAND into a single package for faster AI performance
A novel packaging technology may soon come to fruition
TSMC produces first Nvidia Blackwell GPU in the US, but it still has to fly to Taiwan for packaging
Advanced CoWoS packaging for GPU dies and HBM3E stacks remains Taiwan-only
TSMC unveils plans for giant AI chips to meet surging compute demands
The big picture: The semiconductor industry is approaching a significant milestone as TSMC prepares to expand the physical scale of its chip packaging technology. At its recent North American Technology Symposium, the company detailed plans for a new generation of CoWoS (Chip-on-Wafer-on-Substrate) technology, enabling the assembly of multi-chiplet processors much larger than those currently in production.
Nvidia transitions to advanced CoWoS-L chip packaging, signaling a major shift for TSMC
Jensen Huang explains Nvidia's evolving chip packaging needs at Taiwan event
Amazon has replaced plastic air pillows with crumpled paper in its packaging worldwide
It still uses plastics in some packaging, though
Amazon is replacing all plastic air pillows with crumpled paper in its packaging
In a nutshell: Have you noticed recently that the plastic air pillows Amazon used to stuff into its fragile deliveries have been disappearing, and replaced with paper filler? It's part of the company's environmental push that will see the use of the pillows completely eliminated by the end of the year.
AI GPU accelerators will be in short supply for two more years, TSMC warns
"It's not Nvidia's fault," TSMC said, "it's us and our CoWoS output"
MSI to stop including manuals and other paper materials with its motherboards
For environmental reasons
Intel gives its enthusiast Rocket Lake SKU a unique new retail box
But only if you shell out for the top SKU
Samsung Lifestyle TVs to come in eco-friendly boxes that can be reused to make pet houses
Win-win for you and your cat
Football Manager 2020's recyclable cardboard packaging could save '20 tonnes' of plastic this year
Football Manager's developers aim to shrink their carbon footprint
