Chiplet articles

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TSMC unveils plans for giant AI chips to meet surging compute demands

The big picture: The semiconductor industry is approaching a significant milestone as TSMC prepares to expand the physical scale of its chip packaging technology. At its recent North American Technology Symposium, the company detailed plans for a new generation of CoWoS (Chip-on-Wafer-on-Substrate) technology, enabling the assembly of multi-chiplet processors much larger than those currently in production.
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AMD Ryzen 9000 desktop CPU lineup leaked ahead of Computex launch

Something to look forward to: AMD is reportedly planning an initial launch of four Zen 5 CPUs ranging from 6 to 16 cores. The Ryzen 9 9950X flagship will be a 16-core / 32-thread CPU, followed by the 12-core / 24-thread Ryzen 9 9900X, the 8-core / 16-thread Ryzen 7 9700X, and the 6-core / 12-thread Ryzen 5 9600. The TDPs range from 65W for the 9600 to 170W for the 9950X.