Something to look forward to: TSMC is moving faster than expected to bring its most advanced chip technology to market. The company confirmed that its N2 process node will enter volume production before the end of 2025, as it accelerates both its domestic rollout in Taiwan and a parallel push to deploy the same technology at its Arizona site.
A tungsten breakthrough could finally make next-gen memory a reality
Why it matters: A team of researchers spanning Taiwan and the United States have combined materials science, device engineering, and process compatibility to address one of the most stubborn challenges in magnetic memory development. With the β-phase tungsten puzzle solved, the research presents a credible path toward mass-produced SOT-MRAM – a technology that until now had remained just beyond reach.
In a nutshell: TSMC's 2nm manufacturing process is in development, and the world's largest semiconductor manufacturer is said to have secured orders from around 15 customers for N2. But companies such as Apple and Nvidia could pay up to 66% more for the generational improvements – a price hike that may be passed on to consumers.