SK Hynix moves 375-layer NAND into mass production, replacing tungsten with molybdenum
Future 480-layer and 604-layer designs will require major manufacturing changes
Samsung averts strike with $340,000 bonuses for semiconductor workers
A last-minute labor deal stopped a strike at the world's largest memory chipmaker
SK Hynix is embedding cooling into HBM memory to stop AI chips from overheating
New iHBM with cooling structures is said to cut thermal resistance by over 30%
DDR6 development begins as Samsung, SK Hynix, and Micron target 2028-2029 launch
The new standard promises major speed gains, but the current DRAM crisis could keep prices high
Samsung workers threaten strike, demand share of $38 billion AI memory windfall
Around 30,000 workers rallied as the union demanded 15% of operating profit, roughly $400,000 per employee
AI boom drives SK Hynix to pay $477,000 bonus per employee
Not everyone in South Korea is happy, though
Chipmakers on track to meet only 60% of AI memory demand by 2027
AI is eating the memory market and relief is still years away
SK Hynix boss says the memory chip shortage is going to last until 2030
Things are going to get much worse, before they start improving
Drone strikes halt a third of the world's helium supply, threatening chip production
The outage at Qatar's Ras Laffan facility is testing contingency plans across the chip industry
Microsoft's Maia AI chip ambitions might include an exclusive SK Hynix HBM3e memory deal
Big Tech buying all the memory chips they can, for years to come
SK Hynix doubles down on high-bandwidth memory with $12.9 billion packaging plant
The new facility will be built in South Korea
Samsung and SK Hynix are jacking up DRAM prices by as much as 70 percent
Hyperscalers and Big Tech are buying every memory chip they can
Samsung pushes HBM4 as it battles SK Hynix for AI memory dominance
2026 will test Samsung's HBM4 bet
Nvidia and SK hynix are building an AI SSD that could be 10x faster
Partnership expands beyond HBM as SK hynix targets 100 million IOPS
ASML's most advanced EUV machine is now central to Intel's comeback strategy
Etching CPUs and other advanced chips with sub-1nm accuracy
SK hynix merges DRAM and NAND into a single package for faster AI performance
A novel packaging technology may soon come to fruition
SK hynix expects to launch DDR6 and GDDR7 successor after 2028
GDDR8 is likely on the horizon
The takeaway: Memory manufacturers have been teasing DDR6 system memory for several years, but a new roadmap from SK hynix suggests the technology may not arrive until the end of this decade. Alongside related technologies such as LPDDR6, 3D DRAM, and the successor to GDDR7, DDR6 is expected to deliver substantial improvements in memory speed and efficiency over current standards.
SK Hynix sells out DRAM, NAND, and HBM capacity into 2026 amid AI frenzy
South Korean memory giant extends lead over Samsung and Micron
Samsung ties employee payouts to stock price in first company-wide incentive program
The three-year plan lets staff choose cash or shares for bonuses
SK hynix edges out rivals with first-to-market HBM4 chips for Nvidia and others
The new chips double the bandwidth with 2,048 input/output terminals
What just happened? SK hynix is preparing to begin mass production of its HBM4 chips, marking a major step forward in memory technology tailored for AI data centers. The South Korean company has completed its internal review and developed faster, more energy-efficient memory that meets rising industry demand. As global AI adoption accelerates, the need for high-speed, power-efficient components to support the expanding data center market continues to grow.
SK hynix and ASML debut world's first High-NA EUV lithography system for DRAM production
ASML's Twinscan NXE:5200B to enable denser DRAM production
Samsung and SK Hynix suffer significant blow to their chipmaking activities in China
The US is making it harder to produce chips in China
SK Hynix says AI boom will fuel strong HBM chip demand through 2030
Massive investments in AI data centers expected to lift HBM market by 30% each year
SanDisk and SK hynix partner on High Bandwidth Flash, promising up to 16× more memory for AI GPUs compared to HBM
Forward-looking: SanDisk introduced its High Bandwidth Flash solution earlier this year, vowing to bring unprecedented capabilities to the NAND Flash market. Now, the US corporation is working with South Korean foundry SK Hynix to try to turn the HBF dream into reality.
SK hynix confirms 3GB GDDR7 modules, paving way for RTX 50 Super VRAM boost
New chips would allow for 18GB of VRAM on a 192-bit bus, or 24GB on a 256-bit bus